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Product
SIROX <Heat-resistant silicone resin for electronic parts> Silicone resin for optical parts DS-8100-2HHandling Company
PelnoxCategories
Usage Scenarios
Electronics & Electrical UseImage | Part Number | Price (excluding tax) | Static viscosity | Hardness | Appearance of cured product | Purpose | Thermal conductivity | Standard curing time | Packing form | Parallel transmittance | Exterior | Visible time | Dynamic viscosity | Thixotropic index | Die shear strength (Si chip/silver base material) | Function | Category |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
DS-8100-2H |
Available upon quote |
E-type viscometer at 25℃ 1S-1: 16.0Pa・s |
JIS K7125 at 25℃: Approximately 90 Shore A |
Visual observation at 25℃: Colorless and translucent |
LED die attach |
Hot wire method: 0.22W/mK |
120℃-1 hour + 150℃-3 hours |
10g |
D=1.0mm, wavelength=400nm: 84% |
Visual observation at 25℃: Colorless to light yellow translucent |
25% thickening time at 25℃: approx. 24 hours |
E-type viscometer at 25℃ 10S-1: 5.0Pa・s |
E-type viscometer (1S-1/10S-1): 3.2 |
Die area 2mm x 2mm, measurement temperature 25℃/150℃: 70/30N |
One-component |
Silicone resin for optical parts |
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Reviews shown here are reviews of companies.