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Epotac <Epoxy adhesive for electronics> Resin for sealing thermostats and relays XA-1295/HQ-1Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Purpose | Standard curing conditions | Packing form | Category |
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XA-1295 |
Available upon quote |
・Tg or below: 5.8 (10^-5/℃) |
JIS K-7215 25℃: 88 Shore D |
JIS K 6911 25℃ 24 hours: 0.2wt% |
JIS K 6911 25℃：4.7 x 10^15 (Ω-cm) |
TMA method: 55℃ |
Weight ratio: 100/35 |
25℃：60,000mPa・s |
25℃: 1.47 |
Visual inspection: black paste |
25℃：55,000mPa・s |
Sensors, relays Thermal fuses General modules |
25℃-24 hours |
5kg |
Terminal sealing for thermal fuses Resin for sealing thermostats and relays |
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