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Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W-AD-45V
Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W-Pelnox

Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W
Pelnox

Pelnox's Response Status

Response Rate

100.0%

Response Time

144.8hours


About This Product

This is a room temperature, fast curing type resin.

■Features

・2-component epoxy resin ・Room temperature curing type ・Polyamide curing agent ・Thixotropy added ・Good adhesion to fluororubber

■Applications

・Fluororubber adhesion ・Adhesion of parts that cannot be heated

■Packaging form

AD-45V: 0.6kg

■How to use

・Ingredients may separate or the filler may settle. Stir well before use. ・Calculate the required base agent and curing agent from the compounding ratio listed in the product information. ・Measure the base agent and curing agent into a polycup, etc. ・Mix the base agent and curing agent well. Please use a stirrer or spatula for stirring. ・When stirring, make sure to thoroughly stir all the way to the corners and bottom of the cup. - Immediately defoam the mixture after stirring. Insufficient defoaming may cause bubbles. ・Pouring or applying the mixed solution. ・Cure under the specified curing conditions. ・Do not cure a large amount at once. There is a risk of smoke or fire.

  • Product

    Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W

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1 Models of Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W

Image Part Number Price (excluding tax) Characteristics after curing Linear expansion coefficient Properties after curing Hardness Properties after curing Flexural modulus Properties after curing: Bending strength Characteristics after curing Water absorption rate Characteristics after curing Volume resistivity Characteristics after curing Glass transition temperature Properties after curing: Shear adhesion Properties before curing Mixing ratio Properties before curing Viscosity Properties before curing Specific gravity Properties before curing Appearance Properties before curing Initial mixing viscosity Purpose Standard curing conditions Packing form Function Category
Epotac <Epoxy adhesive for electronics> Fluororubber adhesive AD-45V/HQ-1W-Part Number-AD-45V

AD-45V

Available upon quote

・Tg or below: 6.1 (10^-5/℃)
・Tg or higher: 11.6 (10^-5/℃)

JIS K 7215 25℃: 79 Shore D

JIS K 6911 25℃ 4mmt: 3,000MPa

JIS K 6911 25℃ 4mmt: 57MPa

JIS K 6911 Boiling 2 hours: 2.1wt%

・JIS K 6911 25℃: 1.6 x 10^15 (Ω-cm)
・JIS K 6911 Boiling 2 hours: 7.0 x 10^12 (Ω-cm)

TMA method: 43℃

・JIS K 6850 25℃ Fluororubber: 0.5MPa [Interfacial peeling]
・JIS K 6850 25℃ Copper: 16MPa [Interface & agglomeration mixture]

Weight ratio: 60/40

25℃: 1,500,000mPa・s

25℃: 1.47

Visual inspection: black

25℃: 54,000mPa・s

Adhesive for fluororubber

25℃-24 hours or more

0.6kg

Low temperature curing High adhesive strength

Adhesive for fluororubber

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About Company Handling This Product

Response Rate

100.0%


Response Time

144.8hrs

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

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  • Japan

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