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Pelnox <Epoxy sealing resin for electronics> One-component resin ZC-210Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Characteristics after curing Linear shrinkage rate | Properties after curing Hardness | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing TI value | Purpose | Standard curing conditions | Packing form | Function | Category |
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ZC-210 |
Available upon quote |
・Tg or below: 1.5 (10^-5/℃) |
120×10×10 (mm): 0.23% |
JIS K 7215 25℃: 96 Shore D |
・JIS K 6911 25℃: 7.2 x 10^16 (Ω・cm) |
JIS K 7197 TMA method: 175℃ |
・25℃ 1rpm: 780Pa・s |
Buoyancy method: 1.84 |
Visual observation: black liquid |
0.5/5rpm 25℃: 3.0 |
Semiconductor module General module |
160℃-1 hour |
30g (syringe product) |
One-component, low stress, low curing shrinkage, low warpage |
Resin for semiconductors One-component resin |
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