Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T-XM-5896T

Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T
Pelnox

About This Product

This is a resin with a proven track record for relay sealing, with little outgassing during curing.

■Features・One-component heat-curing epoxy resin
・Low outgas products
・Low temperature curing

■ApplicationsSealing for relays

■Packaging formXM-5896 T: 1kg

■How to use・Items must be kept refrigerated or frozen. Allow it to come to room temperature before opening. Moisture may get mixed in due to condensation.
・Ingredients may separate or the filler may settle. Stir well before use.
・Please defoam thoroughly. Insufficient defoaming may cause bubbles.
・Please cast or apply.
・Cure under the specified curing conditions.
・Please be careful not to cure a large amount at once as it may reach high temperatures and cause smoke or burns.

■Characteristics after curing Volume resistivity・JIS K 6911 25℃：6.1 x 10^16 (Ω-cm)
・JIS K 6911 Boiling 2 hours: 1.2 x 10^16 (Ω-cm)
・JIS K 6911 Boiling 24 hours: 1.7 x 10^13 (Ω-cm)

Model
There is 1 model available for this product.

Product
Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T

Handling Company
Pelnox

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1 Models of Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T

Image	Part Number	Price (excluding tax)	Characteristics after curing Linear expansion coefficient	Properties after curing Hardness	Characteristics after curing Heat distortion temperature	Properties after curing Flexural modulus	Properties after curing: Bending strength	Characteristics after curing Water absorption rate	Properties after curing: Shear adhesive strength	Characteristics after curing Glass transition temperature	Properties before curing Viscosity	Properties before curing Specific gravity	Properties before curing Appearance	Condition before curing Gel time	Properties before curing TI value	Purpose	Standard curing conditions	Packing form	Function	Category
	XM-5896T	Available upon quote	・Tg or below: 5.6 (10^-5/℃) ・Tg or higher: 14.7 (10^-5/℃)	JIS K 7215 25℃: 84 Shore D	JIS K 7191-3: 115℃	JIS K 6911 25℃: 2,800MPa	JIS K 6911 25℃: 70MPa	・JIS K 6911 Boiling 2 hours: 0.8wt% ・JIS K 6911 Boiling 24 hours: 3.2wt%	・JIS K 6850 Fe-Fe: 21MPa ・JIS K 6850 PBT-PBT: 3.1MPa	TMA method: 110℃	25℃: 40,000mPa・s	25℃: 1.2	Visual observation: black viscous liquid	100℃ 5g: about 7 minutes	25℃: 1.6	Automotive electrical components Sensors, relays Thermal fuses General modules	100℃-1 hour	1kg	One-component	Resin for automotive electrical components and various sensors One-component resin Resin for sealing thermostats and relays

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About Company Handling This Product

Pelnox

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

Japan

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Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T Pelnox

About This Product

■Features

■Applications

■Packaging form

■How to use

■Characteristics after curing Volume resistivity

1 Models of Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T

XM-5896T

Other products of Pelnox

About Company Handling This Product

Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5896T
Pelnox