All Categories

History

Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3-XM-5866 TYPE E3
Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3-Pelnox

Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3
Pelnox

Pelnox's Response Status

Response Rate

100.0%

Response Time

144.8hours


About This Product

High thermal conductivity, one-component.

■Features

・One-component heat-curing epoxy resin ・Low temperature curing ・Provides thermal conductivity

■Packaging form

XM-5866 TYPE E3: 5kg

■How to use

・Items must be kept refrigerated or frozen. Allow it to come to room temperature before opening. Moisture may get mixed in due to condensation. ・Ingredients may separate or the filler may settle. Stir well before use. ・Please defoam thoroughly. Insufficient defoaming may cause bubbles. ・Please cast or apply. ・Cure under the specified curing conditions. ・Please be careful not to cure a large amount at once as it may reach high temperatures and cause smoke or burns.

  • Product

    Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3

Share this product


80+ people viewing

Last viewed: 3 hours ago


Free
Get started with our free quotation service - no cost, no obligation.

No Phone Required
We respect your privacy. You can receive quotes without sharing your phone number.

1 Models of Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3

Image Part Number Price (excluding tax) Characteristics after curing Linear expansion coefficient Properties after curing Hardness Characteristics after curing Heat distortion temperature Characteristics after curing Thermal conductivity Properties after curing Flexural modulus Properties after curing: Bending strength Characteristics after curing Water absorption rate Characteristics after curing Volume resistivity Characteristics after curing Glass transition temperature Properties before curing Viscosity Properties before curing Specific gravity Properties before curing Appearance Condition before curing Gel time Purpose Standard curing conditions Packing form Function Category
Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3-Part Number-XM-5866 TYPE E3

XM-5866 TYPE E3

Available upon quote

・Tg or less: 3.0 (10^-5/℃)
・Tg or higher: 10.2 (10^-5/℃)

JIS K-7215 25℃: 95 Shore D

JIS K-7191-3: 127℃

Rapid thermal conductivity meter: 1.6W/mk

JIS K-6911, thickness 3mm: 120,000MPa

JIS K-6911, thickness 3mm: 80MPa

JIS K 6911 Boiling for 2 hours: 0.3wt%

・JIS K 6911 25℃: 0.7 x 10^16 (Ω-cm)
・JIS K 6911 Boiling 2 hours: 1.0 x 10^14 (Ω-cm)

TMA method: 110℃

25℃: 106,000mPa・s

25℃: 2.22

Visual inspection: Black viscous liquid

100℃, 10g scale: approx. 35 minutes

Automotive electrical components Sensors, relays General modules Varistors, thermistors

100℃-2 hours

5kg

One-component high thermal conductivity

Resin for automotive electrical components and various sensors One-component resin

Other products of Pelnox

Reviews shown here are reviews of companies.


View more products of Pelnox

About Company Handling This Product

Response Rate

100.0%


Response Time

144.8hrs

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

See More

  • Japan

This is the version of our website addressed to speakers of English in the United States. If you are a resident of another country, please select the appropriate version of Metoree for your country in the drop-down menu.

Copyright © 2025 Metoree