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Pelnox <Epoxy sealing resin for electronics> One-component resin XM-5866 TYPE E3Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Characteristics after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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XM-5866 TYPE E3 |
Available upon quote |
・Tg or less: 3.0 (10^-5/℃) |
JIS K-7215 25℃: 95 Shore D |
JIS K-7191-3: 127℃ |
Rapid thermal conductivity meter: 1.6W/mk |
JIS K-6911, thickness 3mm: 120,000MPa |
JIS K-6911, thickness 3mm: 80MPa |
JIS K 6911 Boiling for 2 hours: 0.3wt% |
・JIS K 6911 25℃: 0.7 x 10^16 (Ω-cm) |
TMA method: 110℃ |
25℃: 106,000mPa・s |
25℃: 2.22 |
Visual inspection: Black viscous liquid |
100℃, 10g scale: approx. 35 minutes |
Automotive electrical components Sensors, relays General modules Varistors, thermistors |
100℃-2 hours |
5kg |
One-component high thermal conductivity |
Resin for automotive electrical components and various sensors One-component resin |
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