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Pelnox <Epoxy sealing resin for electronics> One-component resin WE-3020Handling Company
PelnoxImage | Part Number | Price (excluding tax) | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Category |
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WE-3020 |
Available upon quote |
DSC method: 110℃ |
25℃: 2,800mPa・s |
25℃: 1.20 |
Visual observation: blackish brown liquid |
150℃ hot plate: 120 seconds |
Binder |
150℃-30 minutes |
1kg |
One-component resin |
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