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Pelnox <Epoxy sealing resin for electronics> One-component resin WE-2025Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Characteristics after curing Linear shrinkage rate | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Properties after curing Tensile modulus | Properties after curing: Tensile strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Characteristics after curing Shear adhesive strength | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Category |
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WE-2025 |
Available upon quote |
・Tg or below: 6.4 (10^-5/℃) |
13×13×120 (mm): 1.8% |
JIS K 7215 25℃: 87 Shore D |
JIS K 7191-3: 95℃ |
JIS K 6911 25℃: 2,560MPa |
JIS K 6911 25℃: 125MPa |
JIS K 7161 25℃: 1,750MPa |
JIS K 7161 25℃: 83MPa |
JIS K 6911 Boiling 1 hour: 0.30wt% |
JIS K 6911 25℃: 4 x 10^15 (Ω-cm) |
・JIS K 7121 DSC method: 117℃ |
JIS K 6850 25℃ (Fe-Fe): 12.2MPa |
25℃: 440mPa・s |
25℃: 1.16 |
Visual observation: light brown suspended liquid |
120℃: Approximately 15 minutes |
Binder |
120℃-2 hours |
5kg |
One-component resin |
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