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Pelnox <Epoxy sealing resin for electronics> One-component resin ME-5890LCHandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Water absorption rate | Properties after curing: Shear adhesive strength | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-5890LC |
Available upon quote |
Below Tg: 3.6 (10^-5/℃) |
JIS K-7215 25℃: 90 Shore D |
JIS K 6911 Boiling for 2 hours: 0.33wt% |
JIS K-6850 Fe-Fe: 20MPa |
JIS K 6911 25℃：2.0 x 10^16 (Ω-cm) |
TMA method: 123℃ |
25℃: 35,000mPa・s |
25℃: 1.60 |
Visual observation: black viscous liquid |
150℃ hot plate: 3.5 minutes |
Temperature fuse |
140℃-15 minutes |
1kg |
One-component |
One-component resin Environmentally friendly resin Resin for sealing thermostats and relays |
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