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Pelnox <Epoxy sealing resin for electronics> One-component resin ME-5131 LCHandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing Storage modulus | Characteristics after curing Linear expansion coefficient | Characteristics after curing Dielectric breakdown voltage | Properties after curing Hardness | Characteristics after curing Curing shrinkage rate (linear shrinkage rate) | Characteristics after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Properties after curing: Tensile strength | Properties after curing Tensile modulus | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Characteristics after curing Shear adhesive strength | Characteristics after curing tanδ peak top | Characteristics after curing E” peak top | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-5131LC |
Available upon quote |
DMA method 25℃ 1Hz 5℃/min: 3.6GPa |
・Tg or below: 4.7 (10^-5/℃) |
JIS K 6911 25℃: 18.0kV/mm |
JIS K 7215 25℃: 90 Shore D |
14×120×12.5 (mm) 25g: 0.6% |
Rapid thermal conductivity meter: 0.8W/mk |
JIS K 6911 25℃ Film thickness 2mm: 5,630MPa |
JIS K 6911 25℃ Film thickness 2mm: 87MPa |
JIS K 7161 25℃ Speed 10mm/min: 51MPa |
JIS K 7161 25℃ Speed 10mm/min: 3,288MPa |
JIS K 6911 2 hours after boiling: 0.5wt% |
・JIS K 6911 25℃: 1.2 x 10^16 (Ω-cm) |
TMA method: 89℃ |
・JIS K 6850 25℃ (SUS-SUS): 14MPa |
DMA method: 153℃ |
DMA method: 147℃ |
25℃: 40,000mPa・s |
25℃: 1.57 |
Visual observation: black liquid |
73℃ 5g: 17 minutes |
Automotive electrical components Sensors, relays General modules |
73℃-120 minutes |
3kg |
One component, low temperature curing, moisture resistance, fast curing |
Resin for automotive electrical components and various sensors One-component resin |
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