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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-5080 LCHandling Company
PelnoxImage | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-5080LC |
Available upon quote |
・Tg or below: 2.3 (10^-5/℃) |
JIS K 7215 25℃: 92 Shore D |
JIS K 6911 25℃:2.5 x 10^15 (Ω-cm) |
TMA method: 34℃ |
25℃: 280,000mPa・s |
25℃: 1.74 |
Visual observation: black viscous liquid |
130℃ heating plate: about 15 minutes |
Sensor, relay thermal fuse |
130℃-1 hour |
1kg |
One-component Low stress Low curing shrinkage Low warping Impact resistance Stress relaxation |
Resin for automotive electrical components and various sensors One-component resin |
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