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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-5064Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing Storage modulus | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Characteristics after curing Shear adhesive strength | Characteristics after curing tanδ peak top | Characteristics after curing E” peak top | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Properties before curing TI value | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-5064 |
Available upon quote |
DMA method 25℃ 1Hz 5℃/min: 3,300GPa |
・Tg or below: 52 (10^-5/℃) |
JIS K 7215 25℃: 89 Shore D |
JIS K 6911 25℃ Film thickness 4mm: 4,500MPa |
JIS K 6911 25℃ Film thickness 4mm: 127MPa |
JIS K 6911 Boiling for 2 hours: 1.0wt% |
・JIS K 6911 25℃: 6.3 x 10^15 (Ω-cm) |
TMA method: 110℃ |
JIS K 6850 25℃ (Copper-Copper): 20MPa |
DMA method: 128℃ |
DMA method: 120℃ |
25℃: 75,000mPa・s |
25℃: 1.40 |
Visual observation: white viscous liquid |
130℃ 10g: 10 minutes |
3.8 |
Automotive electrical components Sensors, relays General modules |
130℃-60 minutes |
3kg |
One-component, low stress, long pot life, impact resistance, stress relief |
Resin for automotive electrical components and various sensors One-component resin Environmentally friendly resin |
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