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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-372/HY-680Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Curing exothermic temperature rise value | Characteristics after curing Curing shrinkage rate | Characteristics after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-372 |
Available upon quote |
UL-94 2mm, 3mm: V-0 |
・Tg or below: 4.5 (10^-5/℃) |
JIS K 7215 25℃: 91 Shore D |
100g scale: +81℃ (cured at 75℃) |
Volumetric shrinkage rate: 3.5% |
0.60W/mk |
JIS K 6911 25℃: 5,800MPa |
JIS K 6911 25℃: 53MPa |
JIS K 6911 Boiling for 2 hours: 0.6wt% |
JIS K 6911 25℃：6.8 x 10^15 (Ω-cm) |
TMA method: 66℃ |
Weight ratio: 100/20 |
25℃: 20,000mPa・s |
25℃: 1.59 |
Visual observation: black liquid |
25℃: 2,000mPa・s |
75℃ 40g: 38 minutes |
General module |
75℃-2 hours |
20kg |
Low stress Stress relaxation |
Resin for automotive electrical components and various sensors |
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