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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-352/HY-332 (room temperature curing type)Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Properties after curing Hardness | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-352 (room temperature curing type) |
Available upon quote |
UL-94: V-0 equivalent |
JIS K 7215 25℃: 84 Shore D |
JIS K 6911: 4,600MPa |
JIS K 6911: 67MPa |
JIS K 6911 Boiling 2 hours: 1.63% |
JIS K 6911 Normal: 4.3 x 10^14 (Ω-cm) |
TMA method: 41℃ |
Weight ratio: 100/15 |
25℃: 24,000mPa・s |
25℃: 1.59 |
Visual observation: black viscous liquid |
25℃: 3,500mPa・s |
Film capacitor general module |
25℃-24 hours or more |
5kg, 20kg |
Low temperature curing |
Resin for automotive electrical components and various sensors |
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