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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2-ME-113
Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2-Pelnox

Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2
Pelnox


About This Product

Flexible type with excellent heat resistance.

■Features

・Two-component heat-curing epoxy resin ・Amine curing agent ・Flexible resin ・Low viscosity ・Low stress ・Heat cycle resistance

■Applications

・Encapsulation material for semiconductor modules ・In-vehicle electrical components ・Sensor, relay

■Packaging form

ME-113: 1kg, 5kg

■How to use

・Ingredients may separate or the filler may settle. Stir well before use. ・Calculate the required base agent and curing agent from the compounding ratio listed in the product information. ・Measure the base agent and curing agent into a polycup, etc. ・Mix the base agent and curing agent well. Please use a stirrer or spatula for stirring. ・When stirring, make sure to thoroughly stir all the way to the corners and bottom of the cup. - Immediately defoam the mixture after stirring. Insufficient defoaming may cause bubbles. ・Pouring or applying the mixed solution. ・Cure under the specified curing conditions. ・Do not cure a large amount at once. There is a risk of smoke or fire.

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    Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2

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1 Models of Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2

Image Part Number Price (excluding tax) Characteristics after curing Linear expansion coefficient Properties after curing Hardness Properties after curing: Elongation at break Properties after curing Tensile modulus Properties after curing: Tensile strength Characteristics after curing Water absorption rate Characteristics after curing Volume resistivity Characteristics after curing Glass transition temperature Properties before curing Mixing ratio Properties before curing Viscosity Properties before curing Specific gravity Properties before curing Appearance Properties before curing Initial mixing viscosity Condition before curing Gel time Purpose Standard curing conditions Packing form Function Category
Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-113/XH-1859-2-Part Number-ME-113

ME-113

Available upon quote

・Below Tg: (120℃-2 hours, 100℃-4 hours) 6.8 (10^-5/℃), (85℃-4 hours) 7 (10^-5/℃)
・Tg or higher: 22 (10^-5/℃)

JIS K-7215 25℃: 15 Shore A

Dumbbell No. 2 100mm/min: (120℃-2 hours) 208%, (100℃-4 hours) 207%, (85℃-4 hours) 197%

Dumbbell No. 2 100mm/min: 0.2MPa

Dumbbell No. 2 100mm/min: (120℃-2 hours, 100℃-4 hours) 0.7MPa, (85℃-4 hours) 0.6MPa

JIS K 6911 Boiling 2 hours: (120℃-2 hours) 1.7wt%, (100℃-4 hours/85℃-4 hours) 1.8wt%

JIS K 6911 25℃: (120℃-2 hours) 1.6 x 10^12 (Ω-cm), (100℃-4 hours) 1.4 x 10^12 (Ω-cm), (85℃-4 hours) 1.0 x 10^12 (Ω-cm)

・TMA method: -25℃
・DSC method: -26℃

Weight ratio: 100/100

25℃: 11,000mPa・s

25℃: 1.15

Visual inspection: transparent, black

25℃: 900mPa・s

100℃: 1.5 hours

Automotive electrical components Sensors, relays General modules

120℃-2 hours or 100℃-4 hours or 85℃-8 hours

1kg, 5kg

Flexible, low stress, heat cycle resistance

Resin for automotive electrical components and various sensors

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About Company Handling This Product

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

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