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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors ME-105/HY-680 (high heat resistant type)Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Dielectric constant | Characteristics after curing Dielectric loss tangent | Characteristics after curing Linear expansion coefficient | Characteristics after curing Dielectric breakdown voltage | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Pot life | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-105 (high heat resistant type) |
Available upon quote |
JIS K 6911 1MHz: 4.3 |
JIS K 6911 1MHz: 2.9% |
Below Tg: 7.6 (10^-5/℃) |
JIS K 6911 25℃: 24kv/mm |
JIS K-7215 25℃: 85 Shore D |
JIS K-7191-3: 100℃ |
JIS K-7171: 2,500MPa |
JIS K-7171: 130MPa |
JIS K 6911 Boiling for 2 hours: 0.62wt% |
JIS K 6911 25℃: 10^14 or more (Ω-cm) |
TMA method: 105℃ |
Weight ratio: 100/33 |
25℃: 4,000mPa・s |
25℃: 1.15 |
Visual inspection: each color (transparent, black) |
25℃: 5 hours |
Sensor, relay general module |
100℃-2 hours |
1kg, 5kg |
Heat resistance |
Resin for automotive electrical components and various sensors |
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