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Pelnox <Epoxy sealing resin for electronics> Resin for automotive electrical components and various sensors AG-1A/AG-1B-2Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Properties after curing Flexural modulus | Properties after curing: Bending strength | Properties after curing Tensile modulus | Properties after curing: Tensile strength | Characteristics after curing Water absorption rate | Properties after curing: Shear adhesive strength | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition point | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Curing exothermic temperature | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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AG-1A |
Available upon quote |
・Tg or below: 6.7 (10^-5/℃) |
JIS K 7215 25℃: 80 Shore D |
JIS K 6911 25℃: 2,200MPa |
JIS K 6911 25℃: 81MPa |
JIS K 7161 25℃: 1,130MPa |
JIS K 7161 25℃: 40MPa |
JIS K 6911 Boiling 1 hour: 3.2wt% |
JIS K 6850 at25℃ Adherent iron-iron: 12MPa |
・JIS K 6911 25℃: 1.2 x 10^14 (Ω-cm) |
TMA method: 40℃ |
Weight ratio: 100/100 |
25℃: 4,500mPa・s |
3g scale approx. 40mmΦ small plate 25℃: 50.9℃ (approx. 4 minutes) |
25℃: 1.20 |
Visual observation: pale yellow transparent liquid |
・20g scale 25℃: 3 minutes 30 seconds |
General module |
25℃-100 minutes |
1kg |
Low stress Low temperature curing Fast curing Impact resistance Stress relaxation |
Resin for automotive electrical components and various sensors |
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