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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Purpose | Standard curing conditions | Packing form | Function | Category |
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ZC-206 |
Available upon quote |
・Tg or below: 9.9 (10^-6/℃) |
JIS K-7215 25℃: 97 Shore D |
JIS K-6911: 18,000MPa |
JIS K-6911: 180MPa |
・JIS K 6911 Boiling 2 hours: 0.04wt% |
JIS K 6911 25℃: 10^16 or more (Ω-cm) |
TMA method: 146℃ |
25℃: 82,000mPa・s |
25℃: 2.00 |
Visual inspection: black paste |
Semiconductor module General module |
150℃-1 hour + 150℃-1 hour |
20g (syringe product) |
One-component, low stress, low curing shrinkage, low warpage, heat cycle resistance |
Resin for semiconductors One-component resin |
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