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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206-ZC-206
Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206-Pelnox

Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206
Pelnox

Pelnox's Response Status

Response Rate

100.0%

Response Time

144.8hours


About This Product

A low expansion, low stress resin for COB.

■Features

・Single liquid acid anhydride system ・Syringe delivery products ・Low linear expansion (10ppm) ・High adhesion

■Applications

・COB sealing ・Probe card ・Sensor sealing

■Packaging form

ZC-206: 20g (syringe product)

■How to use

・Items must be kept refrigerated or frozen. Allow it to come to room temperature before opening. Moisture may get mixed in due to condensation. ・Ingredients may separate or the filler may settle. Stir well before use. ・Please defoam thoroughly. Insufficient defoaming may cause bubbles. ・Please cast or apply. ・Cure under the specified curing conditions. ・Please be careful not to cure a large amount at once as it may reach high temperatures and cause smoke or burns.

  • Product

    Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206

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1 Models of Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206

Image Part Number Price (excluding tax) Characteristics after curing Linear expansion coefficient Properties after curing Hardness Properties after curing Flexural modulus Properties after curing: Bending strength Characteristics after curing Water absorption rate Characteristics after curing Volume resistivity Characteristics after curing Glass transition temperature Properties before curing Viscosity Properties before curing Specific gravity Properties before curing Appearance Purpose Standard curing conditions Packing form Function Category
Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-206-Part Number-ZC-206

ZC-206

Available upon quote

・Tg or below: 9.9 (10^-6/℃)
・Tg or higher: 4.2 (10^-5/℃)

JIS K-7215 25℃: 97 Shore D

JIS K-6911: 18,000MPa

JIS K-6911: 180MPa

・JIS K 6911 Boiling 2 hours: 0.04wt%
・85℃85% 168 hours: 0.25wt%
・PCT (121℃-100%) 100 hours: 0.52wt%

JIS K 6911 25℃: 10^16 or more (Ω-cm)

TMA method: 146℃

25℃: 82,000mPa・s

25℃: 2.00

Visual inspection: black paste

Semiconductor module General module

150℃-1 hour + 150℃-1 hour

20g (syringe product)

One-component, low stress, low curing shrinkage, low warpage, heat cycle resistance

Resin for semiconductors One-component resin

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About Company Handling This Product

Response Rate

100.0%


Response Time

144.8hrs

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

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  • Japan

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