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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ZC-203TIHandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ZC-203TI |
Available upon quote |
UL-94:V-0 |
・Tg or below: 2.3 (10^-5/℃) |
JIS K-7215 25℃: 94 Shore D |
JIS K-7191-3: 114℃ |
JIS K-6911: 10,500MPa |
JIS K-6911: 107MPa |
・JIS K 6911 Boiling 24 hours: 0.38wt% |
TMA method: 113℃ |
25℃: 38,000mPa・s |
25℃: 1.76 |
Visual inspection: black liquid |
150℃ hot plate: 3 minutes |
Semiconductor module General module |
150℃-1.5 hours |
1kg |
One-component flame retardant (UL-94, V-0 certified) |
Resin for semiconductors One-component resin |
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