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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors YC-107BHandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Shelf life | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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YC-107B |
Available upon quote |
・Tg or below: 2.2 (10^-5/℃) |
JIS K-7215 25℃: 91 Shore D |
JIS K-7191-3: 162℃ |
JIS K-6911: 7,800MPa |
JIS K-6911: 122MPa |
・JIS K 6911 Boiling 24 hours: 0.39wt% |
・JIS K 6911 25℃: 1.3 x 10^16 (Ω-cm) |
TMA method: 148℃ |
・25℃ 2rpm: 50,000mPa・s |
25℃: 1.74 |
Visual observation: black liquid |
25℃: 12 days |
・90℃: 90 minutes |
Semiconductor module General module |
90℃-2 hours + 150℃-4 hours |
1kg |
One-component |
Resin for semiconductors One-component resin |
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