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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-281/HV-141Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Curing shrinkage rate | Characteristics after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Characteristics after curing Shear adhesive strength | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Properties before curing Pot life | Condition before curing Gel time | Purpose | Standard curing conditions | Function | Category |
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ME-281 |
Available upon quote |
・Tg or below: 1.5 (10^-5/℃) |
JIS K 7215 25℃: 96 Shore D |
0.11% |
Rapid thermal conductivity meter: 0.7W/mK |
JIS K 6911 25℃ Dimensions 10×120×4mm: 14,500MPa |
JIS K 6911 25℃ Dimensions 10×120×4mm: 115MPa |
・JIS K 6911 Boiling 2 hours: 0.11wt% |
・JIS K 6911 25℃: 2.5 x 10^16 (Ω-cm) |
TMA method: 209℃ |
JIS K 6850 25℃ (Ni-Ni): 13MPa |
Weight ratio: 100/100 |
25℃: 28,000mPa・s |
25℃: 1.87 |
Visual observation: black liquid |
25℃: 10,000mPa・s |
・25℃: 5 hours or more |
100℃ 40g: 40 minutes |
Semiconductor modules Automotive electrical components Sensors, relays |
100℃-1 hour + 200℃-1 hour |
Heat resistance High Tg Heat cycle resistance |
Resin for semiconductors Resin for automotive electrical components and various sensors |
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