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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-276/HV-138Handling Company
PelnoxImage | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Characteristics after curing Dielectric breakdown voltage | Properties after curing Hardness | Characteristics after curing Specific gravity of cured product | Characteristics after curing Curing shrinkage rate | Properties after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Properties after curing: Shear adhesive strength | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Characteristics after curing Specific heat | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Pot life | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-276 |
Available upon quote |
UL-94: V-0 equivalent |
・Tg or below: 1.5 (10^-5/℃) |
・JIS K-2110 25℃: 19kV/mm |
JIS K-7215 25℃: 93 Shore D |
Buoyancy method 25℃: 1.88 |
0.04% |
Rapid thermal conductivity meter: 0.60W/mk |
JIS K-6911: 10,000MPa |
JIS K-6911: 100MPa |
JIS K 6911 Boiling for 2 hours: 0.1wt% |
・JIS K-6850 Al-Al: 9MPa |
・JIS K 6911 25℃: 6.8 x 10^15 (Ω-cm) |
TMA method: 186℃ |
・JIS K-7123 25℃: 0.620 J/g・deg |
Weight ratio: 100/100 |
25℃:50,000mPa・s |
25℃: 1.91 |
Visual observation: black liquid |
25℃ viscosity double value: 4 hours |
25℃: 38,000mPa・s |
100℃ 40g: 20 minutes |
Semiconductor modules Automotive electrical components Sensors, relays |
100℃-1 hour + 140℃-1 hour + 180℃-1 hour |
5kg, 20kg |
Heat resistance High Tg Heat cycle resistance Moisture resistance |
Resin for semiconductors Resin for automotive electrical components and various sensors |
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