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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-272 TYPE F/HV-136Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Dielectric constant | Characteristics after curing Dielectric loss tangent | Characteristics after curing Linear expansion coefficient | Characteristics after curing Dielectric breakdown voltage | Properties after curing Hardness | Characteristics after curing Cured product weight | Characteristics after curing Curing shrinkage rate | Characteristics after curing Heat distortion temperature | Characteristics after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Properties after curing: Tensile strength | Characteristics after curing Water absorption rate | Properties after curing Shear adhesive strength | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Pot life | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-272 TYPE F |
Available upon quote |
UL-94: V-0 certified |
・JIS K-6911 1KHz: 4.5 |
・JIS K-6911 1KHz: 0.008 |
・Tg or less: 2.0 (10^-5/℃) |
・JIS K-2110 25℃: 17kV/mm |
JIS K-7215 25℃: 93 Shore D |
Buoyancy method 25℃: 1.83 |
0.39% |
JIS K-7191-3: 171℃ |
Rapid thermal conductivity meter: 0.50W/mk |
JIS K-6911: 10,000MPa |
JIS K-6911: 117MPa |
JIS K-6911: 65MPa |
JIS K 6911 Boiling for 2 hours: 0.1wt% |
・JIS K-6850 Al-Al: 9MPa |
・JIS K 6911 25℃: 5.0 x 10^16 (Ω-cm) |
TMA method: 164℃ |
Weight ratio: 100/100 |
25℃: 30,000mPa・s |
25℃: 1.85 |
Visual observation: black viscous liquid |
25℃ viscosity double value: 8 hours |
25℃: 15,000mPa・s |
100-140℃ 40g: 40-7 minutes |
Semiconductor modules Automotive electrical components Sensors, relays |
170℃-1 hour |
5kg |
Heat resistance Flame retardant (UL-94, V-0 certified) Heat cycle resistance Moisture resistance |
Resin for semiconductors Resin for automotive electrical components and various sensors |
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