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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-269 TYPE T/HV-112 TYPE THandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Pot life | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-269 TYPE T |
Available upon quote |
UL-94: V-0 certified |
・Tg or below: 2.5 (10^-5/℃) |
JIS K-7215 25℃: 91 Shore D |
JIS K-7191-3: 171℃ |
JIS K-6911: 10,300MPa |
JIS K-6911: 79MPa |
JIS K 6911 Boiling for 2 hours: 0.16wt% |
TMA method: 162℃ |
Weight ratio: 100/100 |
25℃: 40,000mPa・s |
25℃: 1.84 |
Visual observation: black viscous liquid |
25℃ viscosity double value: 8 hours |
25℃: 16,000mPa・s |
100℃ 40g: Feb-00min |
Semiconductor modules Automotive electrical components Sensors, relays |
100℃-1 hour + 150℃-3 hours |
5kg |
Heat resistance Flame retardant (UL-94, V-0 certified) Heat cycle resistance |
Resin for semiconductors Resin for automotive electrical components and various sensors |
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