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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-268 TYPE D/HV-110 TYPE DHandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Impurity ions | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Specific gravity of cured product | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Pot life | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-268 TYPE D |
Available upon quote |
・Hardened product grinding (100 mesh pass): Na 2ppm |
UL-94: V-0 certified |
・Tg or below: 2 (10^-5/℃) |
JIS K-7215 25℃: 92 Shore D |
Buoyancy method 25℃: 1.85 |
JIS K-7191-3: 167℃ |
JIS K-6911: 12,000MPa |
JIS K-6911: 125MPa |
JIS K 6911 Boiling for 2 hours: 0.14wt% |
・JIS K 6911 25℃: 2.5 x 10^16 (Ω-cm) |
TMA method: 154℃ |
Weight ratio: 100/100 |
25℃: 39,000mPa・s |
25℃: 1.85 |
Visual observation: black viscous liquid |
25℃ viscosity double value: 8 hours |
25℃: 16,000mPa・s |
100-140℃ 40g: 40-10 minutes |
Semiconductor modules Automotive electrical components Sensors, relays |
140℃-2 hours |
5kg |
Heat resistance Flame retardant (UL-94, V-0 certified) Heat cycle resistance |
Resin for semiconductors Resin for automotive electrical components and various sensors |
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