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Pelnox <Epoxy sealing resin for electronics> Resin for semiconductors ME-255 TYPE T/HV-125 TYPE THandling Company
Pelnox| Image | Part Number | Price (excluding tax) | Properties after curing: Flame retardant | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Thermal conductivity | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-255 TYPE T |
Available upon quote |
UL-94 2mm: V-0 certified |
・Tg or below: 2.3 (10^-5/℃) |
JIS K-7215 25℃: 95 Shore D |
JIS K-7191-3: 160℃ |
Hot wire method: 1w/mk |
JIS K-6911: 9,300MPa |
JIS K-6911: 58MPa |
JIS K 6911 Boiling for 2 hours: 0.13wt% |
JIS K 6911 25℃：9.1 x 10^15 (Ω-cm) |
TMA method: 174℃ |
Weight ratio: 100/100 |
25℃: 34,000mPa・s |
25℃: 1.84 |
Visual observation: black viscous liquid |
25℃: 15,000mPa・s |
Semiconductor module Automotive electrical components |
100℃-1 hour + 150℃-3 hours |
5kg |
Heat resistance Flame retardant (UL-94, V-0 certified) Environmentally friendly |
Resin for semiconductors Environmentally friendly resin |
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