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Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-540/HV-540Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-540 CLEAR |
Available upon quote |
・Tg or below: 6 (10^-5/℃) |
JIS K-7215 25℃: 85 Shore D |
JIS K-7191-3: 55℃ |
JIS K-6911: 2,300MPa |
JIS K-6911: 90MPa |
JIS K 6911 Boiling for 2 hours: 1.5wt% |
JIS K 6911 25℃: 10^15 or more (Ω-cm) |
TMA method: 45℃ |
Weight ratio: 100/60 |
25℃: 11,000mPa・s |
25℃: 1.17 |
Visual observation: slightly blue viscous liquid |
25℃: 5,000mPa・s |
150℃ 7g: 120 minutes |
LED |
150℃-16 hours |
1kg |
Low stress Heat cycle resistance |
Resin for light emitting diodes |
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