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Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522-ME-522-1C
Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522-Pelnox

Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522
Pelnox

Pelnox's Response Status

Response Rate

100.0%

Response Time

144.8hours


About This Product

A fast-curing sealing resin for general-purpose lamp LEDs.

■Features

・Two-component heat-curing epoxy resin ・Acid anhydride curing agent ・Non-filler ・Low temperature fast curing ・Low viscosity and good workability ・Good mechanical strength

■Applications

Encapsulant for LED (bullet type LED)

■Packaging form

ME-522-1C: 5kg

■How to use

・Ingredients may separate or the filler may settle. Stir well before use. ・Calculate the required base agent and curing agent from the compounding ratio listed in the product information. ・Measure the base agent and curing agent into a polycup, etc. ・Mix the base agent and curing agent well. Please use a stirrer or spatula for stirring. ・When stirring, make sure to thoroughly stir all the way to the corners and bottom of the cup. - Immediately defoam the mixture after stirring. Insufficient defoaming may cause bubbles. ・Pouring or applying the mixed solution. ・Cure under the specified curing conditions. ・Do not cure a large amount at once. There is a risk of smoke or fire.

  • Product

    Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522

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1 Models of Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522

Image Part Number Price (excluding tax) Characteristics after curing Linear expansion coefficient Properties after curing Hardness Characteristics after curing Heat distortion temperature Properties after curing Flexural modulus Properties after curing: Bending strength Characteristics after curing Water absorption rate Characteristics after curing Volume resistivity Characteristics after curing Glass transition temperature Properties before curing Mixing ratio Properties before curing Viscosity Properties before curing Specific gravity Properties before curing Appearance Properties before curing Initial mixing viscosity Condition before curing Gel time Purpose Standard curing conditions Packing form Category
Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-522-1C/HV-522-Part Number-ME-522-1C

ME-522-1C

Available upon quote

・Tg or below: 6.4 (10^-5/℃)
・Tg or higher: 18.3 (10^-5/℃)

JIS K-7215 25℃: 89 Shore D

JIS K-7191-3: 142℃

JIS K-6911: 2,800MPa

JIS K-6911: 90MPa

JIS K 6911 Boiling for 2 hours: 0.5wt%

・JIS K 6911 25℃: 10^16 or more (Ω-cm)
・JIS K 6911 Boiling 2 hours: 10^16 or more (Ω-cm)

・TMA method: 142℃
・DSC method: 143℃

Weight ratio: 100/110

25℃: 3,500mPa・s

25℃: 1.17

Visual observation: slight blue liquid

25℃: 650mPa・s

120℃ 8g: 10 minutes

LED

100℃-2 hours + 130℃-2 hours

5kg

Resin for light emitting diodes

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About Company Handling This Product

Response Rate

100.0%


Response Time

144.8hrs

Company Overview

Pelnox, Ltd., established in 1970 and located in Hadano, Kanagawa Prefecture, Japan, is a manufacturer and sup...

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  • Japan

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