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Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-512-1B/HV-512Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Properties after curing: Shear adhesive strength | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Mixing ratio | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Properties before curing Initial mixing viscosity | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-512-1B |
Available upon quote |
・Tg or below: 6.3 (10^-5/℃) |
JIS K-7215 25℃: 89 Shore D |
JIS K-7191-3: 145℃ |
JIS K-6911: 2,700MPa |
JIS K-6911: 90MPa |
JIS K 6911 Boiling for 2 hours: 0.4wt% |
JIS K-6850 Fe-Fe: 24MPa |
・JIS K 6911 25℃: 10^16 or more (Ω-cm) |
・TMA method: 140℃ |
Weight ratio: 100/100 |
25℃: 4,000mPa・s |
25℃: 1.17 |
Visual observation: slight blue liquid |
25℃: 500mPa・s |
120℃ 7g: 14 minutes |
LED |
120℃-6 hours |
5kg |
Low stress |
Resin for light emitting diodes |
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