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Pelnox <Epoxy sealing resin for electronics> Resin for light emitting diodes ME-5000Handling Company
Pelnox| Image | Part Number | Price (excluding tax) | Characteristics after curing Linear expansion coefficient | Properties after curing Hardness | Characteristics after curing Weight loss during curing | Characteristics after curing Curing shrinkage rate (linear shrinkage) | Characteristics after curing Heat distortion temperature | Properties after curing Flexural modulus | Properties after curing: Bending strength | Characteristics after curing Water absorption rate | Characteristics after curing Volume resistivity | Characteristics after curing Glass transition temperature | Properties before curing Viscosity | Properties before curing Specific gravity | Properties before curing Appearance | Condition before curing Gel time | Purpose | Standard curing conditions | Packing form | Function | Category |
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ME-5000 |
Available upon quote |
・Tg or below: 8 (10^-5/℃) |
JIS K-7215 25℃: 85 Shore D |
TG/DTA method 170℃ - 20mg Scale: 6wt% |
JIS K-6901 25g Scale: 1.7% |
JIS K-7191-3: 145℃ |
JIS K-6911: 2,600MPa |
JIS K-6911: 100MPa |
・JIS K 6911 Boiling 1 hour: 0.8wt% |
JIS K 6911 25℃: 2 x 10^15 or more (Ω-cm) |
TMA method: 130℃ |
25℃: 22,000mPa・s |
25℃: 1.20 |
Visual inspection: white paste |
170℃: Approximately 4 minutes |
LED die attach |
170℃ - 1 hour |
6g |
One-component |
Resin for light emitting diodes |
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