Vacuum pressurized reflow oven VPF300
Shinapex
About This Product
■300x300mm heating area, rapid cooling function, formic acid reduction process compatible, vacuum pressurized reflow oven
Vacuum pressurized reflow furnace VPF300 supports heating up to 450℃ and can have a wide range of furnace pressure settings from 100pa to 0.4Mpa. The vacuum chamber supports pressurization up to 0.4Mpa, so the pressure can be varied over a wide range, defoaming and compressing voids trapped in the solder joints, significantly reducing the void ratio inside the solder, and producing high quality. Voidless soldering is possible. The device can be equipped with a formic acid bubbler with a heat retention function. It generates a mixed gas of formic acid and nitrogen at a stable concentration and removes the oxide film on the workpiece through a reduction reaction, making it compatible with fluxless soldering that does not use flux.
■Void reduction effect due to vacuum/pressure reflow
- In atmospheric reflow, there is no pressure change in the atmosphere, so the solder solidifies while voids remain trapped.
・Voids are significantly reduced using the general vacuum reflow method, but voids that have not been completely compressed can still be seen.
・With vacuum + pressure reflow, voids are further compressed, achieving void-free soldering with almost no voids.
■VPF300 Features
・300x300mm heating area
・Reduced process time with excellent cooling system
・Upper and lower heating mechanism that allows output settings for each heater
・Supports heating up to 450℃
・Can be equipped with a bubbler with heat retention function that mixes nitrogen gas and formic acid
・Flexible process construction based on time, temperature, and pressure is possible
・Temperature and pressure measurement data can be saved to a PC
・Equipped with 6 thermocouples for temperature measurement inside the vacuum chamber
・Flexible process construction possible with 5 gas lines
・The 2023 model has improved heating and cooling mechanisms, and supports heating on both sides of the workpiece as standard.
- Setting and editing of temperature, pressure, and gas lines can be done flexibly on the touch panel.
・Temperature and pressure measurement data can be downloaded to a computer
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Product
Vacuum pressurized reflow oven VPF300
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Handling Company
Shinapex
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Categories
1 Models of Vacuum pressurized reflow oven VPF300
| Product Image | Part Number | Price (excluding tax) |
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VPF300 |
Available upon quote |
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