Vacuum reflow oven TVF200
Shinapex
About This Product
■Heating settings up to 450℃, compatible with formic acid reduction process, standard board cooling function, space-saving tabletop type, vacuum reflow oven TVF200
This is a tabletop vacuum reflow oven that significantly reduces voids inside the solder by changing the pressure inside the process chamber, enabling high-quality void-free soldering. The heating area is 200mm x 200mm x height 50mm, and it supports heating from above and below.The pressure can be set arbitrarily from atmospheric pressure to 10Pa, and the pressure and heating profile can be flexibly set according to the target work.
■Void reduction effect by vacuum reflow
In atmospheric reflow, there is no pressure change in the atmosphere, so the solder solidifies while voids remain trapped. By varying the pressure inside the process chamber from atmospheric pressure to a vacuum of around 10 Pa, voids in the solder can be significantly reduced.
■TVF200 features
・200x200mm heating area
・Supports heating up to 450℃
・Output can be set for each heater
・Reduced process time with excellent cooling function
・Flexible process construction based on time, temperature, and pressure is possible
・Equipped with 4 thermocouples for temperature measurement inside the vacuum chamber
・Equipped with 3 gas lines
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Product
Vacuum reflow oven TVF200
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Handling Company
Shinapex
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Categories
1 Models of Vacuum reflow oven TVF200
| Product Image | Part Number | Price (excluding tax) |
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TVF200 |
Available upon quote |
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