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Aluminum substrate-Aluminum substrate
Aluminum substrate-Taiyo Kogyo Co., Ltd.

Aluminum substrate
Taiyo Kogyo Co., Ltd.


About This Product

■Product information

As electronic devices become smaller and lighter, the mounting density on circuit boards increases, making it important to take measures to prevent the heat generated by the mounted elements. To address this issue, we are proposing an "aluminum substrate" using aluminum and a highly thermally conductive sheet.

■Features of aluminum substrate

・By giving the board itself a heat dissipation effect, it is possible to save space for heat dissipation parts. ・By combining with thick copper foil, it is possible to suppress the temperature rise on the pattern where large current flows.

■Specifications

・Thermal conductivity 1.5W/mk Copper foil thickness 35um Insulation layer thickness 80um Aluminum thickness 1.0mm ・Thermal conductivity 1.5W/mk Copper foil thickness 35um Insulation layer thickness 120um Aluminum thickness 1.0mm ・Thermal conductivity 1.5W/mk Copper foil thickness 35um Insulation layer thickness 80um Aluminum thickness 1.5mm ・Thermal conductivity 1.5W/mk Copper foil thickness 35um Insulation layer thickness 100um Aluminum thickness 2.0mm ・Thermal conductivity 1.5W/mk Copper foil thickness 70um Insulation layer thickness 120um Aluminum thickness 1.0mm ・Thermal conductivity 1.5W/mk Copper foil thickness 70um Insulation layer thickness 100um Aluminum thickness 2.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 35um Insulation layer thickness 100um Aluminum thickness 1.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 35um Insulation layer thickness 120um Aluminum thickness 1.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 35um Insulation layer thickness 120um Aluminum thickness 1.5mm ・Thermal conductivity 3.0W/mk Copper foil thickness 35um Insulation layer thickness 100um Aluminum thickness 2.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 70um Insulation layer thickness 120um Aluminum thickness 1.5mm ・Thermal conductivity 3.0W/mk Copper foil thickness 105um Insulation layer thickness 120um Aluminum thickness 1.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 105um Insulation layer thickness 120um Aluminum thickness 2.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 200um Insulation layer thickness 100um Aluminum thickness 2.0mm ・Thermal conductivity 3.0W/mk Copper foil thickness 500um Insulation layer thickness 100um Aluminum thickness 2.0mm

  • Product

    Aluminum substrate

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1 Models of Aluminum substrate

Image Part Number Price (excluding tax)
Aluminum substrate-Part Number-Aluminum substrate

Aluminum substrate

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