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Flatness, bow, warp, curvature, thickness non-contact optical automatic measuring device OEG FLATSCAN
Irie Co., Ltd.


About This Product

■FLATSCAN

FLATSCAN is an automatic 2D/3D measurement device for wafer warp, bow, tilt, and surface curvature. A calculation module for thin film stress on wafers and glass substrates is included.

■Applications

FLATSCAN is used for non-contact measurements of flatness, waviness, mean radius and thin film stress on all types of reflective surfaces such as silicon wafers, mirrors, X-ray mirrors (gopel mirrors), metal surfaces and polished polymers. High accuracy is ensured by measuring the reflection angle of a normally incident laser beam at equal intervals along a line. The surface shape can be accurately calculated from the change in reflection angle between measurement points. For applications that require reflection angle evaluation, the software includes a measurement option. As an example of semiconductor applications, the thin film stress in a coating can also be calculated from the radius of curvature measured before and after coating.

■Large measurement field possible

One of the major features of this device is that it does not depend on the size of the measurement field. Therefore, a measuring field diameter of 200 mm is standard, but the field can be increased arbitrarily without reducing accuracy.

■High measurement accuracy

FLATSCAN is characterized by high measurement accuracy. The resolution of the measurement system is 0.1 arcsec. The reproducibility of the surface shape reaches 100nm.

■Wide measurement dynamic range, working distance

The measuring range can be measured up to the maximum measuring height (or the smallest measurable radius of curvature) in just one scan. FLATSCAN is characterized by an extremely large measurement range that cannot be achieved with competing methods such as fringe interferometry. FLATSCAN is therefore suitable for measuring surfaces with strong curvature, such as Gobel mirrors and silicon wafers. The measuring head has a long working distance from the sample and there is no risk of damaging the sample.

■2D, 3D measurement (optional)

Depending on the device type, you can perform single line scans or full 3D scans. 3D scanning involves automatic sample positioning followed by many single line scans. The software has functions for graphical display of measurement results, such as 3D views, cross-section views, and measurement protocols.

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    Flatness, bow, warp, curvature, thickness non-contact optical automatic measuring device OEG FLATSCAN

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1 Models of Flatness, bow, warp, curvature, thickness non-contact optical automatic measuring device OEG FLATSCAN

Image Part Number Price (excluding tax) Surface curvature repeatability (PV) Free working distance Automatic measurement sequence Measurement speed Measurement wavelength Measurement field Accuracy of optical measurement system Resolution of optical measurement system Minimum radius of curvature and maximum measurement height for scan length Sample thickness

FLATSCAN

Available upon quote

≦100nm

No limit

Possible

10mm~30mm/sec

Standard 670nm

Standard ø200mm* (larger fields also possible)

1 arcsec

0.1 arcsec

200mm R =18m, 290μm, 300mm R =25m, 435μm, 500mm R =43m, 725μm

No limit

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