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Electronic parts department Denka heat dissipation spacer-FSL-F3
Electronic parts department Denka heat dissipation spacer-Denka Company Limited

Electronic parts department Denka heat dissipation spacer
Denka Company Limited

Denka Company Limited's Response Status

Response Rate

100.0%

Response Time

144.3hours


About This Product

■Seshin Overview

It is a material with high thermal conductivity (low thermal resistance) made by highly filling silicone with our ceramic filler. It adheres well to the irregularities of electronic components such as CPUs and MPUs, and can efficiently transfer heat to the heat dissipation fins.

■Product features

We develop distinctive products through filler selection and compounding technology. We support the selection of materials that match the application and purpose, such as high thermal conductivity and high flexibility.

■Applications

・5G base station ・Automotive (LiB/ECU/inverter/LED headlamp, etc.) ・Storage battery ・PC (MPU, chipset) ・Digital home appliances (IC) ·power supply ・LED lighting

  • Product

    Electronic parts department Denka heat dissipation spacer

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1 Models of Electronic parts department Denka heat dissipation spacer

Image Part Number Price (excluding tax) Hardness (Asker C) Features Thermal conductivity (W/mK)
Electronic parts department Denka heat dissipation spacer-Part Number-FSL-F3

FSL-F3

Available upon quote

15

General purpose grade

2

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About Company Handling This Product

Response Rate

100.0%


Response Time

144.3hrs

Company Overview

Denka Company Limited, founded in 1915, is a Japanese chemical manufacturer headquartered in Chuo City, Tokyo....

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  • Japan

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