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  4. Package conversion module (Castech Shoji Co., Ltd.)
Package conversion module-Package conversion module
Package conversion module-Castech Shoji Co., Ltd.

Package conversion module
Castech Shoji Co., Ltd.

About This Product

■Product features

The package conversion module is an epoch-making module that can be mounted as is without changing the board when you need to change the specifications (upgrade) of your device or change the layout due to the end of production. It is also possible to add functions (adding devices, chips, test pins, etc.) as necessary.

■Target package

・DIP→DIP ・DIP→PLCC ・DIP→SOIC ・PGA→QFP ・PLCC → PGA ・PLCC → PGA ・BGA→QFP ・SOIC→DIP ・PGA → PLCC ・TSOP→QFP ・QFP→BGA ・BGA→BGA

■Details

QFP conversion leads to cost benefits by designing unique solder bumps to match the pattern, rather than the shape of the leads.

  • Product

    Package conversion module

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1 Models of Package conversion module

Image Part Number Price (excluding tax)
Package conversion module-Part Number-Package conversion module

Package conversion module

Available upon quote

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About Company Handling This Product

Castech Shoji Co., Ltd.

  • Japan

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