Package conversion module
Castech Shoji Co., Ltd.
About This Product
■Product features
The package conversion module is an epoch-making module that can be mounted as is without changing the board when you need to change the specifications (upgrade) of your device or change the layout due to the end of production. It is also possible to add functions (adding devices, chips, test pins, etc.) as necessary.
■Target package
・DIP→DIP
・DIP→PLCC
・DIP→SOIC
・PGA→QFP
・PLCC → PGA
・PLCC → PGA
・BGA→QFP
・SOIC→DIP
・PGA → PLCC
・TSOP→QFP
・QFP→BGA
・BGA→BGA
■Details
QFP conversion leads to cost benefits by designing unique solder bumps to match the pattern, rather than the shape of the leads.
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Product
Package conversion module
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Handling Company
Castech Shoji Co., Ltd.
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Categories
1 Models of Package conversion module
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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Package conversion module |
Available upon quote |
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About Company Handling This Product
- Japan