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  3. Silicon Wafers
  4. High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ (OSTECH Co., Ltd.)
High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ-DX-7DZ
High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ-OSTECH Co., Ltd.

High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ
OSTECH Co., Ltd.

About This Product

■Device performance

・The measurement accuracy of the device itself is ±30″.When the tolerance of the slicing machine is zero, the 100% measurement angle of the wafer after slicing is within ±0.05°. - Automatically measure the crystal angle, automatically calculate the angle, and set the angle. ・Measurement range of crystal plane angle (θ angle) between 9° and 40°. ・360° omnidirectional blind spot measurement and double inspection on the ingot end face. - Adopts pulse type viscose, and as soon as bubbles are present in the glue during discharge, the ingot and resin pace plate are automatically aligned. ・Upload data according to internet management, scan it and enter it into the system.

■Caution

This device is designed only for 5-12 inch silicon monocrystalline ingots and cannot measure short ingots.

  • Product

    High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ

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1 Models of High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ

Image Part Number Price (excluding tax) Measuring crystal plane Measurement accuracy Minimum reading Ingot diameter Ingot maximum length
High precision fully automatic silicon single crystal X-ray crystal measurement device DX-7DZ-Part Number-DX-7DZ

DX-7DZ

Available upon quote

100,111,110 and various measurement angles

±30″

1″

6~12 inches

450mm

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About Company Handling This Product

OSTECH Co., Ltd.

  • Japan

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Silicon Wafers
Silicon Wafers　OSTECH Co., Ltd.
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