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Positive photoresist ma-P1205
OSTECH Co., Ltd.


About This Product

■Unique features of positive photoresist

・Sensitivity to g-line, i-line or broadband exposure ・No post-exposure bake ・Easy removal ・Resist solution that can be used immediately for various viscosities ・Wide process window and easy handling

■Main use

・Etching mask (e.g. Si, SiO2, other semiconductors, metals) ・Ion implantation mask ・Mold for electroplating

  • Product

    Positive photoresist ma-P1205

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1 Models of Positive photoresist ma-P1205

Image Part Number Price (excluding tax) Film thickness µm Dose @ 365 nm (broadband exposure) mJ cm^-2 Spin coatings Spin coating rpm

Ma-P1205

Available upon quote

0.5

35

30

3,000

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