■Features
・It has a coefficient of thermal expansion that matches that of Si, and is resistant to thermal shock and can withstand rapid heating and cooling.
- No auxiliary agents required, minimizing metal contamination and particle generation.
・Excellent plasma resistance and fluorine gas corrosion resistance.
・A wafer with high thermal conductivity and thermal emissivity, and high thermal uniformity.
■Applications
・Dummy wafer for LP-CVD process
・Dummy wafer for high temperature diffusion process
・Various heat-resistant and chemical-resistant dummy wafers
・Dummy wafer for etching process
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