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AlN ceramic parts FAN-170
OSTECH Co., Ltd.


About This Product

Semiconductor manufacturing equipment (for front-end processes) is required to support smaller design rules (0.18μm or less) and larger wafer diameters (300mm or more). To this end, the selection of materials for the parts that make up the device is extremely important. Aluminum nitride (AlN) is a well-balanced material with excellent thermal conductivity, thermal radiation (heat dissipation), thermal shock resistance, electrical insulation, and thermal expansion matching that of Si wafers. We offer AlN parts for semiconductor manufacturing equipment that take advantage of these characteristics.

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    AlN ceramic parts FAN-170

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1 Models of AlN ceramic parts FAN-170

Image Part Number Price (excluding tax) Metal impurities ppm Dielectric constant (1MHz) Dielectric loss 10^-4 (1MHz) Dielectric strength kV/mm (RT) Insulation resistance Ω cm (RT) Features Thermal expansion coefficient 10^-6/℃ (RT~400℃) Thermal emissivity (100℃) Thermal conductivity W/m·K (RT) Bending strength kgf/mm2 Density g/cm3 Y% O %

FAN-170

Available upon quote

<50

8.8

5

15

>1013

General purpose

4.5

0.93

170

35

3.32

3.5

1.5

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