Semiconductor manufacturing equipment (for front-end processes) is required to support smaller design rules (0.18μm or less) and larger wafer diameters (300mm or more). To this end, the selection of materials for the parts that make up the device is extremely important.
Aluminum nitride (AlN) is a well-balanced material with excellent thermal conductivity, thermal radiation (heat dissipation), thermal shock resistance, electrical insulation, and thermal expansion matching that of Si wafers. We offer AlN parts for semiconductor manufacturing equipment that take advantage of these characteristics.
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