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  4. IC socket for device inspection POP (package on package) socket (Toyo Electronics Giken Co., Ltd.)
IC socket for device inspection POP (package on package) socket-Rotating clamshell type
IC socket for device inspection POP (package on package) socket-Toyo Electronics Giken Co., Ltd.

IC socket for device inspection POP (package on package) socket
Toyo Electronics Giken Co., Ltd.

About This Product

■Details

The POP socket has a two-layer contact structure, allowing the MPU and memory to be stored separately for evaluation testing. The rotating pusher mechanism absorbs variations in IC chip thickness and ensures reliable contact.

  • Product

    IC socket for device inspection POP (package on package) socket

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1 Models of IC socket for device inspection POP (package on package) socket

Image Part Number Price (excluding tax)
IC socket for device inspection POP (package on package) socket-Part Number-Rotating clamshell type

Rotating clamshell type

Available upon quote

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About Company Handling This Product

Toyo Electronics Giken Co., Ltd.

  • Japan

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BGA Scokets
BGA Scokets　Toyo Electronics Giken Co., Ltd.
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