IC socket for device inspection POP (package on package) socket
Toyo Electronics Giken Co., Ltd.
About This Product
■Details
The POP socket has a two-layer contact structure, allowing the MPU and memory to be stored separately for evaluation testing. The rotating pusher mechanism absorbs variations in IC chip thickness and ensures reliable contact.
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Product
IC socket for device inspection POP (package on package) socket
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Handling Company
Toyo Electronics Giken Co., Ltd.
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Categories
1 Models of IC socket for device inspection POP (package on package) socket
| Product Image | Part Number | Price (excluding tax) |
|---|---|---|
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Rotating clamshell type |
Available upon quote |
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