Aremkobond 631 | Applicable to various materials epoxy adhesive (organic)
Edec Co., Ltd.
Price (excluding tax)
Model Description
■ Overview "Alem Cobond 631" is a new type of heat -resistant epoxy adhesive, which is also used to glue the site glass of high vacuum equipment. It has a strong adhesive power and corrosion resistance. ■ Characteristics The "Alem Cobond 631" is a two -liquid mixture and has excellent mechanical, electrical and thermal characteristics. Various acids, salt and organic solvents are resistant. It has been found that it is not affected as a result of immersion testing with the following concentrated solution. The same test results for many other chemical products. Hydrochloric acid, phosphoric acid, sulfate, sodium chloride, ammonium hydroxide, sodium hydroxide, jet fuel, gasoline, toluene, etc. "Alem Cobond 631" has passed the outgustest on the ASTM E-595 standard. This is a particularly beneficial factor for aircraft manufacturers who value the out -gas characteristics of substances. ■ How to use The "Alem Cobond 631" uses a curing agent A and bass resin B at a mixed volume ratio of 1: 1. It is well kneaded with a spatula, etc., and coated with about 0.1 to 0.2 mm application thickness. It is completely hardened in either baking at 93 ° C for 2 hours at room temperature or 24 to 48 hours at room temperature.
Model Filter
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Birthday conditions that change to the left
Condensed volatile ingredients (CVCM)
Density (G/CM^3)
Distributed coefficient
Distribution rate (1.0kHz)
Dumpy strength (kgf/cm^2)
Escape force (kgf/cm^2)
Hardness after burning hardening
Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6)
Heat resistance upper limit (℃)
Insulation (KV/mm)
Insulation power (VOLTS/MIL)
Line contraction (%)
Mixed viscosity (CP)
Mixing ratio of resin and curing agent (weight ratio)
Pot life (100g amount @ 25 ℃)
Pull strength (PSI)
Recommended firing conditions
Total quality loss (TML)
Volume-fitted resistance value (ohms^-cm)
capacity
chemical resistance
color
Schrin cage (shrink rate) (mm/mm or in/in)
Heat expansion rate (in/in/℃)
Dealing dialogue (per 1kHz)
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Part Number
Aremkobond 631
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Handling Company
Edec Co., Ltd.
Applicable to various materials epoxy adhesive (organic) Aremkobond 631's performance table
Items marked with have different values depending on the model number.
| Product Image | Price (excluding tax) | Birthday conditions that change to the left | Condensed volatile ingredients (CVCM) | Density (G/CM^3) | Distributed coefficient | Distribution rate (1.0kHz) | Dumpy strength (kgf/cm^2) | Escape force (kgf/cm^2) | Hardness after burning hardening | Heat expansion coefficient (CTE) (IN/IN/℃ x 10^-6) | Heat resistance upper limit (℃) | Insulation (KV/mm) | Insulation power (VOLTS/MIL) | Line contraction (%) | Mixed viscosity (CP) | Mixing ratio of resin and curing agent (weight ratio) | Pot life (100g amount @ 25 ℃) | Pull strength (PSI) | Recommended firing conditions | Total quality loss (TML) | Volume-fitted resistance value (ohms^-cm) | capacity | chemical resistance | color |
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Available upon quote | Room temperature x 24 ~ 48hrs. | 0.35% (25 ° C) | 1.12 | 0.01 | 3.12 | 717 | 210.9 | 75 (Shore D hardness) | 49 | -60 ~ 204 | 17.32 | 440 | 0.2 | 25,000 | 1: 1 | 240min | 3,000 | 93 ℃ x 2HRS. | 0.75% (125 ° C) | 1.2 × 10^14 | 50ml cartridge x 3, 1 pint (≒ 500ml), 1 quote (≒ 1L) | Good | Colored color |
There are 9 models for this product.
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About Company Handling This Product
- Japan
- Since 1973
- 14 employees