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ANSYS Q3D EXTRACTOR® allows high -speed multiple polar polar methods (FMM) to apply high -speed multiple pole (FMM) to high -precision electromagnetic field analysis based on the Moment Law (MOM), and analyze power modules, semiconductor packages, connectors, bath bars. This is a low -frequency electromagnetic field analysis software for analyzing the structure of electronic components such as PCB and cable and extracting RLCG of parasitic parameters. ■ 3D semi -static electromagnetic field Solver Low -frequency 3D semi -electromagnetic field solver allows you to efficiently calculate capacitance (C), condactance (g), magnetic field analysis, and inductance (L). ■ The generation of equivalent circuit models SPICE branch circuits/ladder type equal value circuit models can generate Simplorer SML, HSPICE TABULAR W-ELEMENT, PSPICE, Specter, IBIS ICM/PKG models and Ansys CPP models. ■ Extracting IBIS package model IBIS is an important package model for analysis of signal integrity. Q3D EXTRACTOR is an ideal software for the generation of IBIS package models, as it can generate extremely highly accurate reduction decisor SPICE models. ■ Touch screen design Efficiently analyzing thin conductors such as ITOs allows you to calculate the array -like RLCG matrix data, such as a touch screen device, to solve the design early. ■ "Automatic Adaptive Messing" that does not require complex meshing work ANSYS's excellent meshing technology, "Automatic Adaptive Messing", automatically generates the optimal mesh that matches the wavelengths to be analyzed only by setting analysis frequency and accuracy only. ■ "High Performance Computing (HPC)" to improve analysis speed by parallel processing This option is an option to distribute the following analysis processes to increase the analysis speed by dispersing the following analysis processes for the parallel processing function in the personal computer used for the analysis and the multiple personal computers connected to the network. ・ Multi -threaded ・ Spectral decomposition method ・ DCRL/ACRL/CG analysis ・ Cloud HPC
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Operating environment 2023 R1
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IDAJ Co., Ltd.| Image | Price (excluding tax) | Analysis solver | Material setting | Operating environment 2023 R1 | Post -processing | mesh | modeling |
|---|---|---|---|---|---|---|---|
| Available upon quote | DC R/L analysis AC R/L analysis C/G analysis | Select from the material library Frequency -dependent materials Coordinate -dependent materials | Windows 10 (Professional, Enterprise & Education) Red Hat Enterprise 7 (7.8 & 7.9) Such | RLCG parameter Current distribution Touchstone Spice model IBIS model | Automatic adaptive messing Manual mesh | You can use the common GUI, Ansys Electronics Desktop, to perform model creation and imports. |
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