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This is an optical unit used for alignment in the semiconductor manufacturing process. In order to check the bonding accuracy of the upper and lower fields of view (chip) and lower field of view (die), it is now possible to measure the upper and lower fields of view simultaneously. ■Features ・The high N.A. type allows for highly accurate alignment of minute parts, and the water-cooled/air-cooled structure improves alignment precision deterioration due to temperature changes. ・The thin type has a short distance between the top and bottom, contributing to reductions in takt time and footprint.
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See all 3 models in listPart Number
High-precision alignment lens with two upper and lower fields of viewHandling Company
Kyocera CorporationCategories
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