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■High precision/fine wiring is possible with advanced circuit formation technology MSAP stands for Modified Semi-Additive Process, which allows finer wiring than the subtractive method traditionally used for printed wiring boards. Kyocera's MSAP board can suppress variations in circuit width for products that require reproducibility in circuit finish, such as high-frequency antenna boards. ■Features ・Achieved L/S: 40/40μm or less using miniaturization technology ・Can support pattern accuracy of ±10μm or less ・Can accommodate circuit width variation σ=1.6μm ■Product usage ・In-vehicle ADAS equipment ・In-vehicle ECU ・Information and communication equipment
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MSAP boardHandling Company
Kyocera CorporationCategories
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