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■High density/high reliability makes equipment smaller and lighter MCM stands for Multi Chip Module, and is an electronic component in which multiple ICs with various functions are mounted on a single module board. Kyocera's MCM substrates meet customer needs by achieving high-density mounting through fine wiring and high reliability cultivated through extensive experience in automotive applications. ■Features ・Compatible with filled via structure ・Number of layers: 10 layers (BU structure) / Plate thickness: 1.6mm ・Supports high-density wiring (L/S: 85μm/85μm) ■Product usage ・In-vehicle integrated ECU ・Other equipment that requires high density
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MCM (Mulch chip module)Handling Company
Kyocera CorporationCategories
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