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■Features High bonding properties due to metal sintering of nano silver powder and micron silver powder ・Low electrical resistance ・High thermal conductivity ・Achieve high heat resistance and high reliability by reducing stress using a unique resin dispersion system (high bonding reliability even at high temperatures of 250℃) ■Joining process ・Conventional equipment can be used, no pressure bonding, same application method as conventional silver paste ・Low temperature sintering 200-250℃ ・Curing in air or nitrogen atmosphere
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Silver sintering paste for die attachHandling Company
Kyocera CorporationCategories
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