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■Summary 1.A flexible sheet that is hard to break. 2.Suitable for low profile and large size molding, improving productivity. 3.It has the same reliability as current semiconductor encapsulants. ■Features 1. Compatible with both laminator sealing and compression molding 2. Using a sheet encapsulant reduces resin flow during molding, reducing molding defects.
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Sheet encapsulant for PLP/WLPHandling Company
Kyocera Corporation| Image | Price (excluding tax) |
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Available upon quote |
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