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It is a highly reliable sealing material that has the characteristics of high heat resistance (high glass transition temperature) and low elasticity, and by optimizing the coefficient of thermal expansion (CTE), it relieves stress due to temperature changes. ■Features ・Stress reduction >>> Warpage (CTE, Tg) control, low elasticity ・Moldability >>> Fluidity control, narrow space filling properties ・Heat resistance >>> High glass transition temperature (Tg) ・Long-term reliability >>> Tracking resistance, low ionic impurities
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Encapsulant for power modulesHandling Company
Kyocera Corporation| Image | Price (excluding tax) |
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Available upon quote |
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