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■High adhesion and excellent reflow resistance ・Excellent reflow resistance due to high adhesion ・Excellent high temperature storage properties ・We have materials compatible with various frames such as copper, 42Alloy, and Pd/Au plating. ■Recommended use ・Semiconductor encapsulation for automotive equipment ・Semiconductor encapsulation for electronic devices ・Applicable packages: TSOP, SOP, Larger QFP, Smaller QFP, QFN, DIP, TO, High-Voltage Diode
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Encapsulant for lead framesHandling Company
Kyocera Corporation| Image | Price (excluding tax) |
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Available upon quote |
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